RF and Microwave Microelectronics Packaging II

RF and Microwave Microelectronics Packaging II It is a companion volume to “RF and Microwave Microelectronics Packaging” (2010) and covers the latest developments in thermal management, electricalRFthermal-mechanical designs and simulations, packaging and processing methods, and other RF and microwave packaging topics. Wydawnictwo: Springer Rok wydania: 2018 Okładka: miękka Liczba stron: 172 Wymiary: 23.5 x 15.5 cm Ilustracje: 77 Illustrations, color; 50 Illustrations, black and white Język: angielski ISBN: 9783319847191