Assembly and Reliability of Lead-Free Solder Joints

Assembly and Reliability of Lead-Free Solder Joints This book focuses on the assembly and reliability of lead-free solder joints. Both the principles and engineering practice are addressed, with more weight placed on the latter. This is achieved by providing in-depth studies on a number of major topics such as solder joints in conventional and advanced packaging components, commonly used lead-free materials, soldering processes, advanced specialty flux designs, characterization of lead-free solder joints, reliability testing and data analyses, design for reliability, and failure analyses for lead-free solder joints. Uniquely, the content not only addresses electronic manufacturing services (EMS) on the second-level interconnects, but also packaging assembly on the first-level interconnects and the semiconductor back-end on the 3D IC integration interconnects. Thus, the book offers an indispensable resource for the complete food chain of electronics products. Autor: John H. Lau, Ning-Cheng Lee Wydawnictwo: Springer Rok wydania: 2020 Okładka: twarda Liczba stron: 527 Wymiary: 23.5 x 15.5 cm Ilustracje: 347 Illustrations, color; 251 Illustrations, black and white; XXI, 527 p. 598 illus., 347 illus. in color. Język: angielski ISBN: 9789811539190