Investigations on Microstructure and Mechanical Properties of the CuPb-free Solder Joint Interfaces

Investigations on Microstructure and Mechanical Properties of the CuPb-free Solder Joint Interfaces This thesispresents a series of mechanical test methods and comprehensively investigatesthe deformation and damage behavior of CuPb-free solder joints under differentloading conditions. Autor: Qingke Zhang Wydawnictwo: Springer Rok wydania: 2016 Okładka: miękka Liczba stron: 143 Wymiary: 23.5 x 15.5 cm Ilustracje: 81 Illustrations, color; 34 Illustrations, black and white Język: angielski ISBN: 9783662517253