Modeling and Design of Electromagnetic Compatibility for High-Speed Printed Circuit Boards and Packaging

Modeling and Design of Electromagnetic Compatibility for High-Speed Printed Circuit Boards and Packaging Modeling and Design of Electromagnetic Compatibility for High-Speed Printed Circuit Boards and Packaging presents the electromagnetic modelling and design of three major electromagnetic compatibility (EMC) issues related to the high-speed printed circuit board (PCB) and electronic packages: signal integrity (SI), power Autor: Xing-Chang Wei Wydawnictwo: Taylor & Francis Rok wydania: 2020 Okładka: miękka Liczba stron: 322 Wymiary: 23.4 x 15.6 cm Język: angielski ISBN: 9780367573669