New Prospects of Integrating Low Substrate Temperatures with Scaling-Sustained Device Architectural Innovation

New Prospects of Integrating Low Substrate Temperatures with Scaling-Sustained Device Architectural Innovation In order to sustain Moores Law-based device scaling, principal attention has focused on toward device architectural innovations for improved device performance as per ITRS projections for technology nodes up to 10 nm. Efficient integration of lower substrate temperatures ( Autor: Nabil Shovon Ashraf, Shawon Alam Wydawnictwo: Springer Rok wydania: 2016 Okładka: miękka Liczba stron: 72 Wymiary: 23.5 x 19.1 cm Ilustracje: VIII, 72 p. Język: angielski ISBN: 9783031008993